Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8419918 | Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby | Young-Taik Hong, Seog Je Kim, Jae-heung Lee | 2013-04-16 |