Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7383156 | Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface | Kouzou Matsusita, Yukinori Matsumura, Tomikazu Tanuki, Mitsuo Terada, Kotaro Hori +2 more | 2008-06-03 |
| 5911257 | Device for removing objects adhered to a plate for bonding a semiconductor wafer | Osamu Morikawa | 1999-06-15 |
| 5849139 | Method of sticking semiconductor wafer and its sticking device | Osamu Morikawa | 1998-12-15 |