Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6162730 | Method for fabricating semiconductor wafers | Fumitaka Kai, Masahiko Maeda, Jun Yamashita, Toshiharu Yubitani, Takamitsu Harada | 2000-12-19 |
| 5899743 | Method for fabricating semiconductor wafers | Fumitaka Kai, Masahiko Maeda, Jun Yamashita, Toshiharu Yubitani, Takamitsu Harada | 1999-05-04 |
| 5880027 | Process for fabricating semiconductor wafer | Toshiharu Yubitani | 1999-03-09 |
| 5873772 | Method for polishing the top and bottom of a semiconductor wafer simultaneously | Toshiharu Yubitani | 1999-02-23 |
| 5821166 | Method of manufacturing semiconductor wafers | Toshiharu Yubitani | 1998-10-13 |
| 5756399 | Process for making semiconductor wafer | Toshiharu Yubitani | 1998-05-26 |
| 5747364 | Method of making semiconductor wafers and semiconductor wafers made thereby | Nobuyuki Akiyama, Fumitaka Kai, Masahiko Maeda, Naoki Yamada | 1998-05-05 |