Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787688 | Methods of forming MEMS diaphragms including corrugations | Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Syskind PEDERSEN | 2023-10-17 |
| 11787690 | MEMS assembly substrates including a bond layer | John B. Szczech, Josh Watson | 2023-10-17 |
| 11716578 | MEMS die with a diaphragm having a stepped or tapered passage for ingress protection | Vahid Naderyan, Ankur R. Sharma, Nick Wakefield | 2023-08-01 |
| 11671766 | Microphone device with ingress protection | Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin +1 more | 2023-06-06 |
| 11617042 | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance | Michael Kuntzman, Michael Syskind PEDERSEN, Bing Yu, Vahid Naderyan, Peter V. Loeppert | 2023-03-28 |
| 11477555 | Acoustic transducers having non-circular perimetral release holes | Michael Kuntzman, Vahid Naderyan, Yunfei Ma, Bing Yu | 2022-10-18 |
| 11310600 | Acoustic transducer with reduced damping | Vahid Naderyan, Michael Kuntzman | 2022-04-19 |
| 11297406 | Acoustic transducers with a low pressure zone and diaphragms having a pressure sensor | Venkataraman Chandrasekaran, Michael Kuntzman, Michael Syskind PEDERSEN | 2022-04-05 |
| 11274034 | Acoustic relief in MEMS | Alyssa Kueffner, Yenhao Chen, Yaoyang Guo, Jeremy R. Hui, John J. Albers +1 more | 2022-03-15 |
| 11228845 | Systems and methods for acoustic hole optimization | Vahid Naderyan, Michael Kuntzman, Wade Conklin | 2022-01-18 |
| 11212621 | Composite diaphragms having balanced stress | Peter V. Loeppert | 2021-12-28 |
| 11206494 | Microphone device with ingress protection | Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin +1 more | 2021-12-21 |
| 10939214 | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance | Michael Kuntzman, Michael Syskind PEDERSEN, Bing Yu, Vahid Naderyan, Peter V. Loeppert | 2021-03-02 |
| 10930672 | Three-dimensional semiconductor memory devices | Siyeon Cho, Hyeri Shin, Yusik Choi, Sungyung Hwang | 2021-02-23 |
| 10887712 | Post linearization system and method using tracking signal | Kim Spetzler Berthelsen, Michael Kuntzman, Claus Erdmann Fürst, Mohammad Shajaan, Venkataraman Chandrasekaran | 2021-01-05 |
| 10887700 | Acoustic apparatus with diaphragm supported at a discrete number of locations | Sagnik Pal | 2021-01-05 |
| 10870577 | Methods of forming MEMS diaphragms including corrugations | Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Syskind PEDERSEN | 2020-12-22 |
| 10726931 | Operation method of memory controller and operation method of storage device | Raeyoung LEE, Hyunjung Kim, Soyeong GWAK, Sang-Wan Nam | 2020-07-28 |
| 10654712 | Elevated MEMS device in a microphone with ingress protection | John J. Albers, Brandon Harrington | 2020-05-19 |
| 10491980 | Multiple MEMS motor apparatus with common vent | — | 2019-11-26 |
| 10433071 | Microphone with hydrophobic ingress protection | Sagnik Pal | 2019-10-01 |
| 10405106 | Differential MEMS microphone | — | 2019-09-03 |
| 10362408 | Differential MEMS microphone | Michael Kuntzman, Wade Conklin | 2019-07-23 |
| 10349184 | Microphone and pressure sensor | Michael Kuntzman, Wade Conklin | 2019-07-09 |
| 10277979 | Reduced-damping acoustic holes | Vahid Naderyan, Wade Conklin, Michael Kuntzman | 2019-04-30 |