Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051569 | Deposition apparatus and deposition method using the same | Kwan Yong LEE, Ji Hoon Shin, Chang Jo Lee, Sung-Ryul Cho, Sang Jin Ha | 2024-07-30 |
| 11637001 | Deposition apparatus and deposition method using the same | Kwan Yong LEE, Ji Hoon Shin, Chang Jo Lee, Sung-Ryul Cho, Sang Jin Ha | 2023-04-25 |
| 11076097 | Method for street view service and apparatus for performing same method | Sung Rae Cho, Yong Jin Kim, Jun-Se Kim | 2021-07-27 |
| D910104 | Cameras | Jun-Se Kim, Sung Rae Cho, Yong Jin Kim | 2021-02-09 |
| D882662 | Cameras | Jun-Se Kim, Sung Rae Cho, Yong Jin Kim | 2020-04-28 |
| 10497671 | Semiconductor packages including chip stacks | Kyung Hwan Cho, Ga Hyun No, Jin Kyoung Park | 2019-12-03 |
| 10419670 | Omnidirectional image capturing method and apparatus performing the method | — | 2019-09-17 |
| 10354115 | Capacitive fingerprint sensor | Ki Joong Kim, Jin Hyeong Yoo, Bong Yeob Hong, Ji Ho Hur | 2019-07-16 |
| 10287468 | CMP slurry composition for organic film and polishing method using same | Yong-Sik Yoo, Jung Min Choi, Dong-Hun Kang, Tae Wan Kim, Go-Un Kim | 2019-05-14 |
| 9725168 | Unmanned aerial vehicle with rotatable gripper | — | 2017-08-08 |
| 8828266 | CMP slurry composition and polishing method using the same | Hyun Soo Roh, Dong Jin Kim, Yong Soon Park, Young Chul Jung | 2014-09-09 |
| 8491682 | Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry | Suk Min Hong, Myung Won Suh, Joon Hwang, Jeong Yun KIM, Dong Hyun Kim | 2013-07-23 |
| 8361177 | Polishing slurry, method of producing same, and method of polishing substrate | Dae-Hyeong Kim, Seok Min Hong, Jae Hyun Jeon, Un Gyu Park, Jea Gun Park | 2013-01-29 |
| 7470295 | Polishing slurry, method of producing same, and method of polishing substrate | Dae Hyung Kim, Seok Min Hong, Jae Hyun Jeon, Ho-Seong Kim, Hyun Soo Park +2 more | 2008-12-30 |
| 7364600 | Slurry for CMP and method of polishing substrate using same | Dae-Hyeong Kim, Seok Min Hong, Jae Hyun Jeon, Ho-Seong Kim, Hyun Soo Park +2 more | 2008-04-29 |