Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7899239 | Inspection method of bonded status of ball in wire bonding | Kimiji Nishimaki | 2011-03-01 |
| 7191929 | Method of measuring thickness of bonded ball in wire bonding | Kimiji Nishimaki | 2007-03-20 |