Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7899239 | Inspection method of bonded status of ball in wire bonding | Noritaka Horiuchi | 2011-03-01 |
| 7191929 | Method of measuring thickness of bonded ball in wire bonding | Noritaka Horiuchi | 2007-03-20 |
| 5566876 | Wire bonder and wire bonding method | Takashi Kamiharako | 1996-10-22 |
| 5474224 | Wire bonder and wire bonding method | Takashi Kamiharako | 1995-12-12 |
| 5458280 | Wire bonder and wire bonding method | Takashi Kamiharako | 1995-10-17 |
| 5456403 | Wire bonder and wire bonding method | Takashi Kamiharako | 1995-10-10 |