Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835889 | Passive element component and substrate with built-in passive element | Toshiro Hiraoka, Koji Asakawa, Shigeru Matake | 2004-12-28 |
| 6709806 | Method of forming composite member | Toshiro Hiraoka, Koji Asakawa, Shigeru Matake | 2004-03-23 |
| 6649516 | Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions | Koji Asakawa, Shigeru Matake, Toshiro Hiraoka | 2003-11-18 |
| 6565764 | Method of manufacturing a material having a fine structure | Toshiro Hiraoka, Koji Asakawa | 2003-05-20 |
| 6565763 | Method for manufacturing porous structure and method for forming pattern | Koji Asakawa, Toshiro Hiraoka, Yoshihiro Akasaka | 2003-05-20 |
| 6465742 | Three dimensional structure and method of manufacturing the same | Toshiro Hiraoka, Koji Asakawa | 2002-10-15 |
| 6437090 | Curing catalyst, resin composition, resin-sealed semiconductor device and coating material | Shinji Murai, Shuji Hayase, Shinetsu Fujieda, Rumiko Hayase | 2002-08-20 |
| 5998509 | Resin composition and semiconductor device employing the same | Rumiko Hayase, Shinetsu Fujieda, Shinji Murai | 1999-12-07 |
| 5912320 | Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device | Shinetsu Fujieda, Tetsuo Okuyama | 1999-06-15 |
| 5705540 | Inorganic filler, manufacturing method thereof, and resin composition containing an inorganic filler | Ken Uchida, Shuzi Hayase | 1998-01-06 |