HH

Hirofumi Hansei

KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Buzen, JP: #8 of 17 inventorsTop 50%
Overall (All Time): #3,359,809 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7393706 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig Masaki Adachi, Masaharu Yamanaka, Fumihide Nagashima, Tatsuhiko Nagafuchi, Takao Abe +2 more 2008-07-01