Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146844 | Material species identification system using material spectral data | — | 2024-11-19 |
| 12095080 | Slurry, all solid state battery and method for producing all solid state battery | Kei Oura | 2024-09-17 |
| 11837721 | Slurry, all solid state battery and method for producing all solid state battery | Kei Oura | 2023-12-05 |
| 11703015 | Three-dimensional additive manufactured product and three-dimensional additive manufacturing method | Akira Ogawara, Katsuhiko Nakamura | 2023-07-18 |
| 11605809 | Anode active material and battery | Tetsuya WASEDA, Satoshi Wakasugi, Jun Yoshida | 2023-03-14 |
| 11108040 | Positive electrode material and secondary battery using same | Ryuta Sugiura, Yuji Yamamoto | 2021-08-31 |
| 11043672 | Negative electrode material including lead fluoride coated active material and electrolyte battery using same | — | 2021-06-22 |
| 10787998 | Cooling mechanism of combustion chamber, rocket engine having cooling mechanism, and method of manufacturing cooling mechanism | Daiki WATANABE, Hiroyuki Kobayashi, Akihide Kurosu, Hideto Kawashima, Nobuki Negoro | 2020-09-29 |
| 9989062 | Fan motor lead wire protection member | — | 2018-06-05 |
| 9120176 | Laser processing machine and laser processing method | Harumi Nishiyama, Hiroshi Onodera, Toshinori Abe | 2015-09-01 |
| 8946948 | Motor with stator cover formed by overlapping two members | Yoshiaki OGUMA, Yasuyuki Kaji | 2015-02-03 |
| 8137079 | Motor, fan and manufacturing method of the same | Shoki YAMAZAKI, Hideki Nagamatsu | 2012-03-20 |
| 8067779 | Light emitting device with a recess lead portion | Tetsuya Muranaka, Iwao Matsumoto, Kenji Naito, Toshiaki Hosoya | 2011-11-29 |
| 7534000 | Incorporation of telltale warning indicators into driver information center | Ching Fong, Zinoviy Kelman, Joseph Pasek, Brian P. Dehmlow | 2009-05-19 |
| 7393706 | Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig | Masaharu Yamanaka, Fumihide Nagashima, Tatsuhiko Nagafuchi, Takao Abe, Masayoshi Harada +2 more | 2008-07-01 |
| 6255739 | Semiconductor device | Megumi Yamamura | 2001-07-03 |
| 6201309 | Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same | Tomoko Honda | 2001-03-13 |
| 6091139 | Semiconductor device | Isao Ogawa | 2000-07-18 |
| 4900985 | High-voltage input terminal structure of a magnetron for a microwave oven | Norio Tashiro, Toshio Ikeda, Hisao Saito, Saburo Matsushita, Masataka Komine | 1990-02-13 |