| 12384888 |
Condensation-curable resin composition, cured product, molded body, and semiconductor device |
Hironori IKENO, Kazuya SUWA, Keisuke Nishizawa, Ayaka KIYA |
2025-08-12 |
| 9593240 |
Thermosetting resin composition |
Akio Tajima, Takashi Matsuo, Yoshiko Ueno, Koichi Ayama |
2017-03-14 |
| 9512273 |
Thermosetting resin composition |
Akio Tajima, Takashi Matsuo, Koichi Ayama |
2016-12-06 |
| 9115243 |
Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor |
Akio Tajima, Takashi Matsuo, Kiyoshi Sakai, Koichi Ayama |
2015-08-25 |
| 8987358 |
Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor |
Akio Tajima, Takashi Matsuo, Yoshiko Watanabe, Koichi Ayama |
2015-03-24 |
| 8952108 |
Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor |
Daisuke Inoki, Akio Tajima, Takashi Matsuo |
2015-02-10 |
| 8946357 |
Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor |
Akio Tajima, Takashi Matsuo, Kiyoshi Sakai, Koichi Ayama |
2015-02-03 |
| 6310169 |
Polymerizable terminal group-containing polyorganosiloxane and production process for the same |
Youichi Kimae |
2001-10-30 |