AK

Ayaka KIYA

JN Jnc: 1 patents #221 of 413Top 55%
Overall (All Time): #2,445,489 of 4,157,543Top 60%
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Patent #TitleCo-InventorsDate
12384888 Condensation-curable resin composition, cured product, molded body, and semiconductor device Hironori IKENO, Kazuya SUWA, Keisuke Nishizawa, Kiichi Kawabata 2025-08-12