Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12167545 | Multilayer substrate | Takayuki Shimamura, Yusuke Kamitsubo, Ryutatsu MIZUKAMI | 2024-12-10 |
| 11680332 | Surface-treated copper foil, and copper-clad laminate and circuit board using same | Takahiro Tsuruta, Takeo Uno, Yuko Okuno, Yoshimasa Nishi | 2023-06-20 |
| 11365353 | Black liquid-crystal polymer film and multilayer board | Yoshimasa Nishi, Akira Moriya, Kanto Iida | 2022-06-21 |
| 10959330 | Metal-clad laminate, circuit board, and multilayer circuit board | Kazuhiko Ohashi, Takeshi Eda | 2021-03-23 |
| 10701811 | Surface-treated copper foil, and copper-clad laminate and printed wiring board using same | Takeo Uno, Yuko Okuno, Takahiro Tsuruta, Yoshimasa Nishi | 2020-06-30 |
| 5580618 | LCD article from liquid crystal filled, hydrophilically-coated, porous PTFE film | Kouichi Okino, Kazuhiko Ohashi | 1996-12-03 |
| 5473118 | Printed circuit board with a coverlay film | Kazuhiko Ohashi, Akira Urakami | 1995-12-05 |
| 5446315 | Resin-sealed semiconductor device containing porous fluorocarbon resin | Yoshito Hazaki, Minoru Hatakeyama, Akira Urakami | 1995-08-29 |
| 5294487 | Composite layered material containing a silicone resin substrate | Kazuhiko Ohashi | 1994-03-15 |
| 5252383 | Carrier sheet for printed circuits and semiconductor chips | Kazuhiko Ohashi, Takayuki Wani | 1993-10-12 |
| 5116663 | Ceramic substrate material containing an amorphous fluorine resin | Hiroyoshi Fujimoto, Rie Egashira | 1992-05-26 |
| 5061990 | Semiconductor device and the manufacture thereof | Ryutaro Arakawa | 1991-10-29 |