Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11680332 | Surface-treated copper foil, and copper-clad laminate and circuit board using same | Takahiro Tsuruta, Yuko Okuno, Sunao Fukutake, Yoshimasa Nishi | 2023-06-20 |
| 10701811 | Surface-treated copper foil, and copper-clad laminate and printed wiring board using same | Yuko Okuno, Takahiro Tsuruta, Yoshimasa Nishi, Sunao Fukutake | 2020-06-30 |
| 9263814 | Metal material for electrical electronic component | Kazuo Yoshida, Kyota Susai, Shuichi Kitagawa, Kengo Mitose | 2016-02-16 |
| 8852754 | Surface-treated copper foil, method for producing same, and copper clad laminated board | Satoshi Fujisawa, Koichi Hattori | 2014-10-07 |
| 8674229 | Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate | Akira Kawakami, Yuji Suzuki | 2014-03-18 |
| 8557392 | Flexible copper clad laminate | Satoshi Fujisawa, Yuji Suzuki, Koichi Hattori, Naoya Kuwasaki | 2013-10-15 |
| 8512873 | Surface treated copper foil and copper clad laminate | Satoshi Fujisawa, Yuji Suzuki | 2013-08-20 |
| 8342895 | Connector and metallic material for connector | Kazuo Yoshida, Kyota Susai, Shuichi Kitagawa | 2013-01-01 |
| 7946022 | Copper alloy for electronic machinery and tools and method of producing the same | Chikahito Sugahara, Kuniteru Mihara | 2011-05-24 |