Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE43536 | Stackable layer containing ball grid array package | — | 2012-07-24 |
| 7242082 | Stackable layer containing ball grid array package | — | 2007-07-10 |
| 6967411 | Stackable layers containing ball grid array packages | — | 2005-11-22 |
| 6195268 | Stacking layers containing enclosed IC chips | — | 2001-02-27 |
| 6028352 | IC stack utilizing secondary leadframes | — | 2000-02-22 |
| 6014316 | IC stack utilizing BGA contacts | — | 2000-01-11 |
| 5612570 | Chip stack and method of making same | John A. Forthun, Harlan R. Isaak | 1997-03-18 |
| 5313096 | IC chip package having chip attached to and wire bonded within an overlying substrate | — | 1994-05-17 |
| 4956694 | Integrated circuit chip stacking | — | 1990-09-11 |