JF

John A. Forthun

DM Dense-Pac Microsystems: 3 patents #2 of 9Top 25%
DT Dpac Technologies: 1 patents #4 of 6Top 70%
ET Entorian Technologies: 1 patents #14 of 27Top 55%
SG Staktek Group: 1 patents #14 of 25Top 60%
Overall (All Time): #658,683 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
RE41039 Stackable chip package with flex carrier 2009-12-15
6908792 Chip stack with differing chip package types Ted Bruce 2005-06-21
6660561 Method of assembling a stackable integrated circuit chip Mark G. Gordon 2003-12-09
6627984 Chip stack with differing chip package types Ted Bruce 2003-09-30
6473308 Stackable chip package with flex carrier 2002-10-29
6262895 Stackable chip package with flex carrier 2001-07-17
5869353 Modular panel stacking process Aaron Uri Levy, John Patrick Sprint, Harlan R. Isaak, Joel Andrew Mearig, Mark Chandler Calkins 1999-02-09
5612570 Chip stack and method of making same Floyd K. Eide, Harlan R. Isaak 1997-03-18