TJ

Tim J. Jondrow

HP HP: 2 patents #2,312 of 7,018Top 35%
Overall (All Time): #2,234,071 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6018193 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink Paul Rubens, Charlie W. Gilson, Brian G. Spreadbury, Horst F. Irmscher 2000-01-25
5960535 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink Paul Rubens, Charlie W. Gilson, Brian G. Spreadbury, Horst F. Irmscher 1999-10-05