HI

Horst F. Irmscher

HP HP: 2 patents #2,312 of 7,018Top 35%
📍 Corvallis, OR: #849 of 1,763 inventorsTop 50%
🗺 Oregon: #12,654 of 28,073 inventorsTop 50%
Overall (All Time): #2,234,070 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6018193 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink Paul Rubens, Charlie W. Gilson, Brian G. Spreadbury, Tim J. Jondrow 2000-01-25
5960535 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink Paul Rubens, Charlie W. Gilson, Brian G. Spreadbury, Tim J. Jondrow 1999-10-05