Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7806994 | Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium | Ronald W. Smith | 2010-10-05 |
| 6224289 | Power takeoff unit-driven unit adapter with sump lubrication | Kevin D. Redd | 2001-05-01 |