Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11416989 | Drug anomaly detection | Xin Liu, Ruomin Ba, BIN-GANG DUAN, Xu Yang, Hang Wang | 2022-08-16 |
| 10685944 | Film sensors array and method | — | 2020-06-16 |
| 10625435 | Electronic pipe and tube cutting system | — | 2020-04-21 |
| 9799448 | Inductor, transformer, and method | — | 2017-10-24 |
| 9704644 | Flexible circuit assembly and method therof | — | 2017-07-11 |
| 9668352 | Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly | Jin-Joo Park, Masahiko Kouchi | 2017-05-30 |
| 9282596 | Intelligent lighting system | — | 2016-03-08 |
| D732731 | Electronic fixture | — | 2015-06-23 |
| 8998454 | Flexible electronic assembly and method of manufacturing the same | Jin-Joo Park | 2015-04-07 |
| 8945657 | Dehydrated pulp slurry and method of making | Douglas A. Bippert | 2015-02-03 |
| 8890287 | Integrated nano-farad capacitors and method of formation | — | 2014-11-18 |
| 8879276 | Flexible circuit assembly and method thereof | — | 2014-11-04 |
| 8153510 | Semiconductor bond pad patterns and method of formation | — | 2012-04-10 |
| 7868729 | Stacked device assembly with integrated coil and method of forming same | Carl E. D'Acosta, Justin E. Poarch | 2011-01-11 |
| 7713781 | Methods for forming quad flat no-lead (QFN) packages | William G. McDonald | 2010-05-11 |
| 7705440 | Substrate having through-wafer vias and method of forming | — | 2010-04-27 |
| 7704517 | Topical cosmetic composition containing hybrid silicone composite powder | Jin L. Hung, Thomas J. Hrubec, David Granatell | 2010-04-27 |
| 7652357 | Quad flat no-lead (QFN) packages | William G. McDonald | 2010-01-26 |
| 7619297 | Electronic device including an inductor | — | 2009-11-17 |
| 7615866 | Contact surrounded by passivation and polymide and method therefor | Paul Hui | 2009-11-10 |
| 7524731 | Process of forming an electronic device including an inductor | — | 2009-04-28 |
| 7489026 | Methods and apparatus for a Quad Flat No-Lead (QFN) package | William G. McDonald | 2009-02-10 |
| 7337942 | Carton | — | 2008-03-04 |
| 7339275 | Multi-chips semiconductor device assemblies and methods for fabricating the same | Justin E. Poarch | 2008-03-04 |
| 7208841 | Semiconductor device with strain relieving bump design | Jin-Wook Jang, Alfredo V. Mendoza, Rajashi Runton, Russell Shumway | 2007-04-24 |