Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7543917 | Integrated circuit and method for manufacturing | Simon Dodd, S. Jonathan Wang, Dennis Tom, Frank R. Bryant, Terry McMahon +1 more | 2009-06-09 |
| 7150516 | Integrated circuit and method for manufacturing | Simon Dodd, S. Jonathan Wang, Dennis Tom, Frank R. Bryant, Terry McMahon +1 more | 2006-12-19 |
| 6441838 | Method of treating a metal surface to increase polymer adhesion | Domingo Figueredo, Ronald L. Enck | 2002-08-27 |
| 6286939 | Method of treating a metal surface to increase polymer adhesion | Domingo Figueredo, Ronald L. Enck | 2001-09-11 |
| 6209991 | Transition metal carbide films for applications in ink jet printheads | Michael J. Regan, Brian J. Keefe, Ali Emamjomeh, Roger J. Kolodziej, Ulrich Hess +2 more | 2001-04-03 |
| 6155674 | Structure to effect adhesion between substrate and ink barrier in ink jet printhead | Domingo Figueredo, Brian J. Keefe, Ali Emamjomeh, Roger J. Kolodziej, Grant Webster +1 more | 2000-12-05 |
| 5443713 | Thin-film structure method of fabrication | — | 1995-08-22 |
| 5338423 | Method of eliminating metal voiding in a titanium nitride/aluminum processing | Jack Berg | 1994-08-16 |
| 5317187 | Ti/TiN/Ti contact metallization | Jack Berg, Peter Nicholas Manos | 1994-05-31 |
| 5244831 | Method of doping a polysilicon layer on a semiconductor wafer | John Allen Rule, Jack Berg | 1993-09-14 |
| 5240880 | Ti/TiN/Ti contact metallization | Jack Berg, Peter Nicholas Manos | 1993-08-31 |