Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7368818 | Methods of making microelectronic assemblies including compliant interfaces | Craig Mitchell, Thomas H. DiStefano, John W. Smith | 2008-05-06 |
| 6870272 | Methods of making microelectronic assemblies including compliant interfaces | Craig Mitchell, Thomas H. DiStefano, John W. Smith | 2005-03-22 |
| 6723584 | Methods of making microelectronic assemblies including compliant interfaces | Craig Mitchell, Thomas H. DiStefano, John W. Smith | 2004-04-20 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Craig Mitchell, Thomas H. DiStefano, John W. Smith | 2003-02-25 |
| 6373141 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Thomas H. DiStefano, John W. Smith | 2002-04-16 |
| 6370032 | Compliant microelectronic mounting device | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis | 2002-04-09 |
| 6274820 | Electrical connections with deformable contacts | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 2001-08-14 |
| 6266874 | Methods of making microelectronic components having electrophoretically deposited layers | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 2001-07-31 |
| 6255738 | Encapsulant for microelectronic devices | Thomas H. DiStefano, Craig Mitchell, Mark Thorson | 2001-07-03 |
| 6239386 | Electrical connections with deformable contacts | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 2001-05-29 |
| 6202299 | Semiconductor chip connection components with adhesives and methods of making same | Thomas H. DiStefano, Gus Karavakis, Craig Mitchell | 2001-03-20 |
| 6133639 | Compliant interface for semiconductor chip and method therefor | Craig Mitchell, Thomas H. DiStefano, John W. Smith | 2000-10-17 |
| 6045655 | Method of mounting a connection component on a semiconductor chip with adhesives | Thomas H. DiStefano, Gus Karavakis, Craig Mitchell | 2000-04-04 |
| 6030856 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Thomas H. DiStefano, John W. Smith | 2000-02-29 |
| 6012224 | Method of forming compliant microelectronic mounting device | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis | 2000-01-11 |
| 5875545 | Method of mounting a connection component on a semiconductor chip with adhesives | Thomas H. DiStefano, Gus Karavakis, Craig Mitchell | 1999-03-02 |
| 5706174 | Compliant microelectrionic mounting device | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis | 1998-01-06 |
| 5659952 | Method of fabricating compliant interface for semiconductor chip | Craig Mitchell, Thomas H. DiStefano, John W. Smith | 1997-08-26 |
| 5619017 | Microelectronic bonding with lead motion | Thomas H. DiStefano, John Grange | 1997-04-08 |
| 5590460 | Method of making multilayer circuit | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 1997-01-07 |
| 5548091 | Semiconductor chip connection components with adhesives and methods for bonding to the chip | Thomas H. DiStefano, Gus Karavakis, Craig Mitchell | 1996-08-20 |
| 5491302 | Microelectronic bonding with lead motion | Thomas H. DiStefano, John Grange | 1996-02-13 |
| 4239789 | Maskless method for electroless plating patterns | Samuel E. Blum, Robert J. von Gutfeld | 1980-12-16 |