Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272662 | Semiconductor structure | Chien-Ming Lai, Hui-Ling Chen | 2025-04-08 |
| 11869854 | Semiconductor structure formed with inductance elements | Chien-Ming Lai, Hui-Ling Chen | 2024-01-09 |
| 11355431 | Semiconductor structure | Chien-Ming Lai, Hui-Ling Chen | 2022-06-07 |
| 10580823 | Wafer level packaging method | Sheng Zhang, Wen-Bo Ding, Chien-En Hsu, Chien-Kee Pang | 2020-03-03 |