Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923365 | Connection structure and method for forming the same | Chia-Yun Wu, Tsyr-Shyang Liou | 2021-02-16 |
| RE46540 | Method and apparatus for integrating a surface acoustic wave filter and a transceiver | Tsyr-Shyang Liou | 2017-09-05 |
| 7460851 | Method and apparatus for integrating a surface acoustic wave filter and a transceiver | Tsyr-Shyang Liou | 2008-12-02 |
| 7064421 | Wire bonding package | Chun-Ming Chen, Wei-Chou Hung | 2006-06-20 |