Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978682 | Package, and method for manufacturing power semiconductor module | Akiyoshi Osakada, Teppei Yamaguchi | 2024-05-07 |
| 11901268 | Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith | Teppei Yamaguchi | 2024-02-13 |
| 6781488 | Connected construction of a high-frequency package and a wiring board | Masato Shiobara | 2004-08-24 |
| 6489679 | High-frequency package | Masato Shiobara, Yoshihisa Araya | 2002-12-03 |