Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978682 | Package, and method for manufacturing power semiconductor module | Yoshio Tsukiyama, Teppei Yamaguchi | 2024-05-07 |
| 7632716 | Package for high frequency usages and its manufacturing method | Ichirou Muraki, Kouichi Nakasu | 2009-12-15 |