Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866280 | Chip package | Soo-Min Choi, Hyeong-No Kim, Jae-Sun An, Sang-Jin Cha | 2014-10-21 |
| 7964952 | Stacked semiconductor package assembly having hollowed substrate | — | 2011-06-21 |
| 7528474 | Stacked semiconductor package assembly having hollowed substrate | — | 2009-05-05 |