YK

Yong Tae Kwon

NC Nepes Co.: 13 patents #1 of 58Top 2%
AU Autotac: 5 patents #1 of 17Top 6%
Caltech: 4 patents #683 of 4,321Top 20%
HE Hynix (Hyundai Electronics): 3 patents #254 of 1,604Top 20%
SF Seoul National University R&Db Foundation: 3 patents #189 of 2,771Top 7%
GC Goldstar Electron Co.: 1 patents #72 of 188Top 40%
LC Lg Semicon Co.: 1 patents #258 of 547Top 50%
📍 Seoul, CA: #156 of 604 inventorsTop 30%
Overall (All Time): #114,789 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 26–31 of 31 patents

Patent #TitleCo-InventorsDate
6339260 Wire arrayed chip size package 2002-01-15
6278178 Integrated device package and fabrication methods thereof Jin-Sung Kim 2001-08-21
6159732 Nucleic acid encoding mammalian Ubr1 Alexander Varshavsky 2000-12-12
6114760 Ball grid array (BGA) semiconductor package member Jin-Sung Kim, Kwang Sung Choi 2000-09-05
5861312 Nucleic acid encoding mammalian UBR1 Alexander Varshavsky 1999-01-19
5559372 Thin soldered semiconductor package 1996-09-24