Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6856011 | Semiconductor chip package and method of fabricating same | — | 2005-02-15 |
| 6458627 | Semiconductor chip package and method of fabricating same | — | 2002-10-01 |
| 6114760 | Ball grid array (BGA) semiconductor package member | Jin-Sung Kim, Yong Tae Kwon | 2000-09-05 |