Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | HeeJo Chi, HyungMin Lee | 2016-07-12 |
| 8710634 | Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof | HeeJo Chi, Jae Han Chung, Junwoo Myung, HyungMin Lee | 2014-04-29 |