Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389553 | Method for forming power module package, power module package and electronic device | Quansong Luo, Yanggui Feng, Xi Liu, Kaijian Yang, Liang Jin | 2025-08-12 |
| 10601325 | DC-to-dC converter circuit and circuit board layout structure for the same | Shengli Lu, Wenhua Li | 2020-03-24 |