Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389553 | Method for forming power module package, power module package and electronic device | Yanbing Xia, Yanggui Feng, Xi Liu, Kaijian Yang, Liang Jin | 2025-08-12 |
| 10700022 | Inductor structure mounted on PCB board and voltage regulator module having the same | Xiangxing Zheng, Wenhua Li, Yuanyuan Dan, Haijun Yang, Shaohua Zhu | 2020-06-30 |
| 10418337 | Inductor structure mounted on PCB board and voltage regulator module having the same | Xiangxing Zheng, Wenhua Li, Yuanyuan Dan, Haijun Yang, Shaohua Zhu | 2019-09-17 |