Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278222 | Method of fabricating semiconductor package including sub-interposer substrates | Chulwoo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2025-04-15 |
| 12272628 | Semiconductor package having interposer substrate | Seungbin Baek, Hyunjung Song, Sangmin Yong | 2025-04-08 |
| 12237241 | Semiconductor package | Seungbin Baek, Hyunjung Song, Jisun YANG | 2025-02-25 |
| 12057408 | Semiconductor packages | Chulwoo Kim, Soohyun Nam | 2024-08-06 |
| 12021032 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Jinhyun Kang, Sungeun Kim, Sangmin Yong, Seungkwan Ryu | 2024-06-25 |
| 11935867 | Semiconductor package with memory stack structure connected to logic dies via an interposer | Sungeun Kim, Sangmin Yong, Hae-Jung Yu | 2024-03-19 |
| 11721679 | Semiconductor package and method of fabricating the same | Chulwoo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2023-08-08 |
| 11694961 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Jinhyun Kang, Sungeun Kim, Sangmin Yong, Seungkwan Ryu | 2023-07-04 |
| 11145637 | Semiconductor package including a substrate having two silicon layers formed on each other | Chulwoo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2021-10-12 |