Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021032 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Sungeun Kim, Sangmin Yong, Seungkwan Ryu | 2024-06-25 |
| 11694961 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Sungeun Kim, Sangmin Yong, Seungkwan Ryu | 2023-07-04 |