Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378414 | Curable organopolysiloxane composition, cured product, and electric/electronic equipment | Lei Fang, Chen-Yi Chen, Masayuki Onishi, Toyohiko Fujisawa, Qi Chen +1 more | 2025-08-05 |
| 10424682 | Multilayer down-converting encapsulant films and electronic devices including the same | John A. Naumovitz, Hongyu Chen, Ada Yu Zhang, Zhi Xu | 2019-09-24 |
| 9908988 | Cured thermoset for high thermal conductive materials | Wei Liu, Xiaomei Song, Hongyu Chen, Yu Zhang | 2018-03-06 |
| 9196595 | Semiconductor bonding structure | Kuo-Hua Chen, Tzu-Hua Lin, Kuan-Neng Chen | 2015-11-24 |
| 8722815 | Two-component moisture curable coating compositions | Hongyu Chen, John A. Roper, III, Christopher J. Tucker, Gerald A. Vandezande, Yanxiang Li +1 more | 2014-05-13 |