Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011444 | Semiconductor package structure | Chin-Li KAO, Chung-Hsuan Tsai, Chia-Pin Chen | 2021-05-18 |
| 7670686 | Long-term hydrophilic modification of PDMS substrate and method for manufacturing the same | Shu-Hui Chen, Makamba Honest, Wang-Chou Sung | 2010-03-02 |
| 7498202 | Method for die attaching | Hung-Ta Hsu, Tzu-Bin Lin, Ya-Ling Huang | 2009-03-03 |