Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7498202 | Method for die attaching | Hung-Ta Hsu, Ya-Ling Huang, Ya-Yu Hsieh | 2009-03-03 | $1,046,000 |
| 7005749 | Flip chip package structure | Hung-Ta Hsu, Ya-Ling Huang | 2006-02-28 | $315,000 |