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Bond and probe pad distribution |
— |
2016-02-23 |
| 9202772 |
Heat pipe in overmolded flip chip package |
— |
2015-12-01 |
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Integrated circuit package architecture |
— |
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| 8148813 |
Integrated circuit package architecture |
— |
2012-04-03 |
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Reticle for wafer test structure areas |
— |
2011-08-23 |
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Reticle for layout modification of wafer test structure areas |
— |
2008-01-08 |
| 7212032 |
Method and apparatus for monitoring yield of integrated circuits |
Jayabrata Ghosh Dastidar, Laiq Chughtai |
2007-05-01 |
| 6982566 |
Method and apparatus for operating a burn-in board to achieve lower equilibrium temperature and to minimize thermal runaway |
Mohammed Didarul Alam |
2006-01-03 |
| 6967111 |
Techniques for reticle layout to modify wafer test structure area |
— |
2005-11-22 |
| 6956165 |
Underfill for maximum flip chip package reliability |
Christopher J. Pass |
2005-10-18 |
| 6030425 |
Catalytic acceleration and electrical bias control of CMP processing |
— |
2000-02-29 |
| 5948697 |
Catalytic acceleration and electrical bias control of CMP processing |
— |
1999-09-07 |
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Method of producing stepped wall interconnects and gates |
— |
1999-03-09 |
| 5366848 |
Method of producing submicron contacts with unique etched slopes |
Nathan Thane |
1994-11-22 |
