Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394751 | Method of forming semiconductor structure | Xinsheng Wang, Li Zhang, Gaosheng Zhang, Xianjin Wan, Ziqun Hua +4 more | 2025-08-19 |
| 12137568 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2024-11-05 |
| 12089405 | Three-dimensional memory devices with channel structures having plum blossom shape | Wanbo Geng, Lei Xue, Xiaoxin Liu, Tingting Gao | 2024-09-10 |
| 12002788 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Jun Liu | 2024-06-04 |
| 11996389 | Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same | Jun Liu | 2024-05-28 |
| 11877449 | Methods for forming three-dimensional memory devices with channel structures having plum blossom shape | Wanbo Geng, Lei Xue, Xiaoxin Liu, Tingting Gao | 2024-01-16 |
| 11864367 | Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same | Jun Liu | 2024-01-02 |
| 11758732 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2023-09-12 |
| 11749641 | Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same | Jun Liu | 2023-09-05 |
| 11721668 | Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same | Jun Liu | 2023-08-08 |
| 11711913 | Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same | Jun Liu | 2023-07-25 |
| 11694993 | Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same | Jun Liu | 2023-07-04 |
| 11631688 | Bonded unified semiconductor chips and fabrication and operation methods thereof | Jun Liu | 2023-04-18 |
| 11562985 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Jun Liu | 2023-01-24 |
| 11527547 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2022-12-13 |
| 11430766 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Jun Liu | 2022-08-30 |
| 11367729 | Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same | Jun Liu | 2022-06-21 |
| 11302706 | Bonded unified semiconductor chips and fabrication and operation methods thereof | Jun Liu | 2022-04-12 |
| 11302700 | Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same | Jun Liu | 2022-04-12 |
| 11158604 | Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same | Jun Liu | 2021-10-26 |
| 11024600 | Unified semiconductor devices having programmable logic device and heterogeneous memories and methods for forming the same | Jun Liu | 2021-06-01 |
| 10923491 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2021-02-16 |
| 10818631 | Semiconductor structure and method of forming the same | Xinsheng Wang, Li Zhang, Gaosheng Zhang, Xianjin Wan, Ziqun Hua +4 more | 2020-10-27 |
| 10811380 | Semiconductor structure and forming method thereof | Xinsheng Wang, Li Zhang, Gaosheng Zhang, Xianjin Wan, Ziqun Hua +4 more | 2020-10-20 |
| 10790297 | Method for forming channel hole in three-dimensional memory device using nonconformal sacrificial layer | Baoyou Chen, Hai Huang, Zhuqing Huang, Guanping Wu, Hongbin Zhu +1 more | 2020-09-29 |