Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966429 | Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage current | Shih-Kuan Chen, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin | 2018-05-08 |
| 9331142 | Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage current | Shih-Kuan Chen, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin | 2016-05-03 |
| 9202935 | Zener diode haviing a polysilicon layer for improved reverse surge capability and decreased leakage current | Shih-Kuan Chen, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin | 2015-12-01 |
| 9041188 | Axial semiconductor package | Chih-Ping Peng, Hui Ding | 2015-05-26 |
| 8796840 | Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers | Kuang Hann Lin, Chih-Ping Peng | 2014-08-05 |
| 8252633 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | Kuang Hann Lin, Chih-Ping Peng | 2012-08-28 |
| 8138597 | Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer | Kuang Hann Lin, Chih-Ping Peng | 2012-03-20 |
| 7915728 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | Kuang Hann Lin, Chih-Ping Peng | 2011-03-29 |
| 7838985 | Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers | Kuang Hann Lin, Chih-Ping Peng | 2010-11-23 |