Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE45286 | Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming | Olivier Le Neel, Peyman Sana, Loi N. Nguyen | 2014-12-09 |
| 8853802 | Method of forming a die having an IC region adjacent a MEMS region | Olivier Le Neel, Loi N. Nguyen | 2014-10-07 |
| 8853850 | MEMS packaging scheme using dielectric fence | Loi N. Nguyen, Venkata Ramana Yogi Mallela | 2014-10-07 |
| 8680631 | High aspect ratio capacitively coupled MEMS devices | Loi N. Nguyen | 2014-03-25 |
| 8432006 | High aspect ratio capacitively coupled MEMS devices | Loi N. Nguyen | 2013-04-30 |
| 8405202 | MEMS packaging scheme using dielectric fence | Loi N. Nguyen, Venkata Ramana Yogi Mallela | 2013-03-26 |
| 8193595 | Method of forming a die having an IC region adjacent a MEMS region | Olivier Le Neel, Loi N. Nguyen | 2012-06-05 |
| 8022491 | High aspect ratio all SiGe capacitively coupled MEMS devices | Loi N. Nguyen | 2011-09-20 |
| 7943410 | Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming | Olivier Le Neel, Peyman Sana, Loi N. Nguyen | 2011-05-17 |