Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114490 | Semiconductor device and method of forming the same | Naoyoshi Kobayashi | 2024-10-08 |
| 11798837 | Methods for forming openings in conductive layers and using the same | Keisuke Otsuka | 2023-10-24 |
| 11056494 | Integrated assemblies having bitline contacts, and methods of forming integrated assemblies | — | 2021-07-06 |
| 11037800 | Patterning methods | Hiromitsu Oshima, Tomohiro Iwaki | 2021-06-15 |
| 10573654 | Integrated assemblies having bitline contacts | — | 2020-02-25 |
| 9741723 | Semiconductor device having shallow trench isolation structure | — | 2017-08-22 |
| 7667317 | Semiconductor package with bypass capacitor | Fumiyuki Osanai, Atsushi Hiraishi, Toshio Sugano, Satoshi Isa, Masahiro Yamaguchi +1 more | 2010-02-23 |