Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315825 | Semiconductor device having wire pieces in bonding member | Daisuke Fukuoka, Tomomi Okumura, Yuuji Ootani, Wataru Kobayashi, Takumi Nomura +3 more | 2025-05-27 |
| 8604608 | Semiconductor module | Jiro Tsuchiya, Torahiko Sasaki, Makoto Imai, Hideki Tojima, Tadakazu Harada | 2013-12-10 |