Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6891275 | Method for accommodating small minimum die in wire bonded area array packages | Ryan David Lane, Edward Reyes, Mark Veatch | 2005-05-10 |
| 6762495 | Area array package with non-electrically connected solder balls | Edward Reyes, Ryan David Lane, Tiona Marburger | 2004-07-13 |