Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5059553 | Metal bump for a thermal compression bond and method for making same | Erich Berndlmaier, Gobinda Das | 1991-10-22 |
| 5053851 | Metal bump for a thermal compression bond and method for making same | Erich Berndlmaier, Gobinda Das | 1991-10-01 |