Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7307775 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satayadev Patel, Andrew Huibers, Steve S. Chiang, Robert M. Duboc, Jr., Hung-Nan Chen +4 more | 2007-12-11 |