Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176326 | Method of forming semiconductor device using high stress cleave plane | Michael I. Current | 2024-12-24 |
| 11901351 | Three dimensional integrated circuit with lateral connection layer | Michael I. Current | 2024-02-13 |
| 11626392 | Method of forming semiconductor device using range compensating material | Michael I. Current | 2023-04-11 |
| 11410984 | Three dimensional integrated circuit with lateral connection layer | Michael I. Current | 2022-08-09 |
| 10923459 | Three dimensional integrated circuit | Michael I. Current | 2021-02-16 |
| 10804252 | Three dimensional integrated circuit | Michael I. Current | 2020-10-13 |
| 10573627 | Three dimensional integrated circuit | Michael I. Current | 2020-02-25 |
| 10049915 | Three dimensional integrated circuit | Michael I. Current | 2018-08-14 |
| 9704835 | Three dimensional integrated circuit | Michael I. Current | 2017-07-11 |