Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8203168 | Integration of SMD components in an IC housing | Felix Schinner, Christian Joos, Wolfgang Hauser, Michael Schmidt | 2012-06-19 |
| 5527742 | Process for coated bonding wires in high lead count packages | Peter Weiler | 1996-06-18 |
| 5455745 | Coated bonding wires in high lead count packages | Peter Weiler | 1995-10-03 |