TT

Ted Tessier

FI Flipchip International: 2 patents #10 of 18Top 60%
📍 Chandler, AZ: #1,637 of 3,331 inventorsTop 50%
🗺 Arizona: #13,050 of 32,909 inventorsTop 40%
Overall (All Time): #2,052,510 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8754524 Wafer-level interconnect for high mechanical reliability applications Anthony P. Curtis, Guy F. Burgess, Michael E. Johnson, Yuan Lu 2014-06-17
8143722 Wafer-level interconnect for high mechanical reliability applications Anthony P. Curtis, Guy F. Burgess, Michael E. Johnson, Yuan Lu 2012-03-27