Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400945 | Electronic device multilevel package substrate for improved electromigration performance | Yiqi Tang, Rajen Manicon Murugan, Sreenivasan K. Koduri | 2025-08-26 |
| 12327736 | Multilayer package substrate with improved current density distribution | Yiqi Tang, Rajen Manicon Murugan, Phuong Minh Vu | 2025-06-10 |
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Yiqi Tang, Rajen Manicon Murugan, Sreenivasan K. Koduri | 2024-05-07 |